Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder

The CoCuFeNi high entropy alloy (HEA) has excellent electrical, thermal, and mechanical properties. In electronic packaging technology, Sn is the major element of lead-free solders. this study, we used HEA as substrate solder investigated liquid/solid interfacial reactions Sn/CoCuFeNi system at 300, 375, 450 °C for 30, 60, 100, 150, 360, 480 min. results indicated that (Fe, Co)Sn2 phase was formed in couples all various reaction temperatures different durations. Additionally, (Co, Ni)Sn2 precipitated side near when time increased. thickness increased with increase temperature time, it proportional to square root time. Overall, our showed growth mechanism diffusion-controlled couples.